China
Spain
Rusia
Italy
GermanySMD291SNL15T4
Part Number Overview
Manufacturer Part Number
SMD291SNL15T4
Description
SOLDER PASTE TWO PART MIX
Detailed Description
Lead Free No-Clean Solder Paste, Two Part Mix Sn96.5Ag3Cu0.5 (96.5/3/0.5) Jar, 0.53 oz (15g)
Manufacturer
Chip Quik Inc.
Standard LeadTime
4 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Chip Quik Inc.
Series
-
Package
Jar
Product Status
Active
Type
Solder Paste, Two Part Mix
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423 ~ 428°F (217 ~ 220°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
4
Process
Lead Free
Form
Jar, 0.53 oz (15g)
Shelf Life
24 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 77°F (3°C ~ 25°C)
Shipping Info
-
Base Product Number
SMD291
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
3810.10.0000
Other Names
-
Category
/Product Index/Soldering, Desoldering, Rework Products/Solder/Chip Quik Inc. SMD291SNL15T4
Documents & Media
Datasheets
1(SMD291SNL15T4 Data Sheet)
Video File
1(Chip Quik’s - Patent Pending Two-Part Mix Solder Paste)
MSDS Material Safety Datasheet
1(SMD291SNL, SMD4300SNL & SMDLTLFP SDS)
Featured Product
1(Patent Pending Two-Part Mix™ Solder Paste)
HTML Datasheet
1(SMD291SNL15T4 Data Sheet)
Quantity Price
Quantity: 1
Unit Price: $20.95
Packaging: Jar
MinMultiplier: 1
Packaging: Jar
MinMultiplier: 1
Substitutes
-