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Part Number Overview
Manufacturer Part Number
HIC-764-SST
Description
CONN IC DIP SOCKET 64POS GOLD
Detailed Description
64 (2 x 32) Pos DIP, 0.75" (19.05mm) Row Spacing Socket Gold Through Hole
Manufacturer
Samtec Inc.
Standard LeadTime
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Samtec Inc.
Series
HIC
Package
Tube
Product Status
Obsolete
Type
DIP, 0.75" (19.05mm) Row Spacing
Number of Positions or Pins (Grid)
64 (2 x 32)
Pitch - Mating
0.070" (1.78mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.070" (1.78mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
200.0µin (5.08µm)
Contact Material - Post
Brass
Housing Material
Polyester, Glass Filled
Operating Temperature
-
Termination Post Length
0.118" (3.00mm)
Material Flammability Rating
UL94 V-0
Contact Resistance
-
Base Product Number
HIC-764
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
California Prop 65
Other Names
-
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Samtec Inc. HIC-764-SST
Documents & Media
PCN Obsolescence/ EOL
1(DK OBS NOTICE)
HTML Datasheet
1(HIC-764-SST Drawing)
Product Drawings
1(HIC-764-SST Drawing)
Quantity Price
-
Substitutes
-