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Part Number Overview
Manufacturer Part Number
0C97055502
Description
RFI EMI GROUNDING MATERIAL 25FT
Detailed Description
Manufacturer
Laird Technologies EMI
Standard LeadTime
8 Weeks
Edacad Model
Standard Package
25
Supplier Stocks
Technical specifications
Mfr
Laird Technologies EMI
Series
Twist
Package
Bulk
Product Status
Active
Type
Fingerstock
Shape
-
Width
0.340" (8.64mm)
Length
24.000" (609.60mm)
Height
0.070" (1.78mm)
Material
Beryllium Copper
Plating
Unplated
Plating - Thickness
-
Attachment Method
Adhesive
Operating Temperature
121°C
Shelf Life Start
-
Shelf Life
-
Storage/Refrigeration Temperature
-
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
Not Applicable
ECCN
EAR99
HTSUS
4016.93.1050
Other Names
-
Category
/Product Index/RF and Wireless/RFI and EMI - Contacts, Fingerstock and Gaskets/Laird Technologies EMI 0C97055502
Documents & Media
Datasheets
1(Low Profile Gasket Catalog)
Video File
1(Laird’s Precision Metals Production and Design Capabilities Overview)
HTML Datasheet
1(Low Profile Gasket Catalog)
Quantity Price
Quantity: 10
Unit Price: $185.299
Packaging: Bulk
MinMultiplier: 10
Packaging: Bulk
MinMultiplier: 10
Substitutes
-