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Part Number Overview
Manufacturer Part Number
14-1518-11H
Description
CONN IC DIP SOCKET 14POS GOLD
Detailed Description
14 (2 x 7) Pos DIP, 0.2" (5.08mm) Row Spacing Socket Gold Through Hole
Manufacturer
Aries Electronics
Standard LeadTime
5 Weeks
Edacad Model
Standard Package
Supplier Stocks
Technical specifications
Mfr
Aries Electronics
Series
518
Package
Bulk
Product Status
Active
Type
DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid)
14 (2 x 7)
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish Thickness - Mating
10.0µin (0.25µm)
Contact Material - Mating
Beryllium Copper
Mounting Type
Through Hole
Features
Open Frame
Termination
Solder
Pitch - Post
0.100" (2.54mm)
Contact Finish - Post
Gold
Contact Finish Thickness - Post
10.0µin (0.25µm)
Contact Material - Post
Brass
Housing Material
Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature
-
Termination Post Length
0.125" (3.18mm)
Material Flammability Rating
UL94 V-0
Current Rating (Amps)
3 A
Contact Resistance
-
Base Product Number
14-1518
Environmental & Export Classifications
RoHS Status
ROHS3 Compliant
Moisture Sensitivity Level (MSL)
1 (Unlimited)
REACH Status
REACH Unaffected
ECCN
EAR99
HTSUS
8536.69.4040
Other Names
-
Category
/Product Index/Connectors, Interconnects/Sockets for ICs, Transistors/IC Sockets/Aries Electronics 14-1518-11H
Documents & Media
Datasheets
1(518 Series Sgl/Dual Solder Pin)
Environmental Information
()
HTML Datasheet
1(518 Series Sgl/Dual Solder Pin)
Quantity Price
Quantity: 157
Unit Price: $3.23197
Packaging: Bulk
MinMultiplier: 157
Packaging: Bulk
MinMultiplier: 157
Substitutes
-