Devices affected:■Zener diode wafer process CPZ28X: wafers bare die in chip form and packaged devices. Extent of change:■The CPZ28X wafer process has been discontinued and replaced with the CPZ58X and
Read morePlease be advised that Central Semiconductor must immediately discontinue the product s listed in the attached PDN notice. Orders can only be accepted for products with available inventory on hand. You
Read more■Description of Change:▲This notice is to inform you that the datasheets for the listed HXT parts have been updated to capture the following errata: GDPD DPDx uLDIS and LDIS must be always set to zero.
Read moreDescription of Change■Silicon Labs is pleased to announce the successful qualification of STARS STARS Microelectronics as an additional assembly test and ship site for BGM111A and MGM111A jointly referred
Read more■ quot TSHT quot quot XAHT quot EEPROM ■ EPROM ▲TSHT: ▲XAHT: ▲ ■ Description of Change:■Giantec has qualified and added 39 TSHT 39 and 39 XAHT as additional package assembly testing subcontractors for
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