■Description of Change: Affected Products: RX Family LFQFP/LQFP Products The assembly and testing base: Renesas Semiconductor Beijing Co. Ltd RSB Changes: Die-bonding and resin materials will be changed.
Read moreSupplemental Information: This notice describes the differences between the updated version Version 10 dated August 20 2009 and its previous version Version 9 dated October 29 2008 of the IDT82P2282 Data
Read moreProduct Identification: EPC2206 Description of Change:■EPC announces the qualification of Ardentec factory as an AEC testing site. Ardentec has IATF 16949 Certification. Ardentec is an existing test site
Read more■To our valued customers Littelfuse would like to notify you that we will replace Carboard reel with ESD plastic reel for Schottky Barrier Rectifier DSTxxx TO-277B packing Products.▲Form fit function changes:
Read more■DESCRIPTION OF CHANGE Standardization with REPG standard packing materials amp to have alternate amp ship-able carrier tape for REGG products to avoid shortage due to very long manufacturing lead time.
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