Discrete Semiconductor Additional Assembly/Test Site / Assembly Bill of Material PRODUCT CHANGE NOTI
DESCRIPTION OF CHANGE ■This PCN is being issued to notify customers that in order to assure continuity of supply Diodes has qualified internal ”Diodes Technology Cheng Du Company Limited” CAT located in
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Discrete Device End of Life (EOL) PRODUCT CHANGE NOTICE(2533)
DESCRIPTION OF CHANGE ■This PCN is being issued to notify customers that products listed below will no longer be available from Diodes Incorporated. For select products on this PCN recommended replacement
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Discrete Clip Bond, Lead Frame, Mold Compound PRODUCT CHANGE NOTICE(2542)
DESCRIPTION OF CHANGE ■This PCN is being issued to notify customers that in order to assure continuity of supply and to improve SMA package manufacturability Diodes Incorporated has qualified additional
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Analog Semiconductor Fab Site, A/T Sites, BOM and Data Sheet Change PRODUCT CHANGE NOTICE(2540)
DESCRIPTION OF CHANGE ■This PCN is being issued to notify customers that in order to assure continuity of supply Diodes has qualified additional Fab Site Dongbu HiTek FAB2 located in Eumseong-gun South
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Discrete Clip Bond, Lead Frame, Mold Compound PRODUCT CHANGE NOTICE(2543)
DESCRIPTION OF CHANGE ■This PCN is being issued to notify customers that in order to assure continuity of supply and to improve SMA package manufacturability Diodes Incorporated has qualified additional
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