Product Category: ■OTN Processors PHYs Description of Change: ■Qualification of ASE as a new bumping facility and assembly site for selected Microsemi products available in 1932L BBGA 45x45x4.0mm package.
Read moreProduct Category: ■Microprocessors Description of Change: This revision includes the following changes Reason for Change: To Improve Manufacturability Brand of Product：MICROCHIP,Part#：SAMA5D4 Series,SAMA5D4,Product
Read moreProduct Category: ■Ethernet PHYs Ethernet Switches Description of Change ■Qualification of MTAI as an additional final test site for selected Microsemi ENT VSC74xx VSC82xx and VSC85xx device families available
Read moreProduct Category: ■16-Bit - Microcontrollers and Digital Signal Controllers 32-bit Microcontrollers Description of Change: ■Qualification of palladium coated copper with gold flash CuPdAu bond wire for
Read moreProduct Category: ■16-Bit - Microcontrollers and Digital Signal Controllers 32-bit Microcontrollers Description of Change: ■This qualification was originally performed to qualify TSMC Fab 6 as an additional
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