Electronic News

PCN # 229：Complementary wafer processes CP230 (NPN) and CP630 (PNP) have been discontinued

Extent of Change: Complementary wafer processes CP230 NPN and CP630 PNP have been discontinued and are being replaced with CP260 NPN and CP660 PNP wafer processes. See figures 1 and 2 for details. Reason

PCN211201：Manufacturing Site Alternate – Qualification as probe site at Ardentec Product / Process C

Description of Change: EPC announces the qualification of ARDENTEC HUKOU as probe test site. ARDENTEC HUKOU is approved as a probe test site for the released to sales part numbers identified in Appendix

No 47-2021: Replacement of boost diode, MOSFET and add alternative component for rectifier

REASON OF CHANGE: Termination of the Fairchild legacy Stealth diodes Newer generation of MOSFET Improvement of the rectifier s supply chain Brand of Product：Vincotech,Part#：10-F006PPA015SB-M684B,10-F006PPA015SB-M684B-/3/,10-F006PPA020SB-M685B,10-F006PPA02

New MiniSKiiP Blister Packaging Customer Notification of x PRODUCT- / PROCESS CHANGE（39-2021）

SUBJECT OF CHANGE Improved design for MiniSKiiP® Blister PRODUCTS AFFECTED MiniSKiiP® 0 1 2 3 blister packaging REASON OF CHANGE:Enable the removal of modules from the cover and the tray Improved protection

PCN210024：Add New Substrate Supplier Daeduck for FCBGA-400 and FCBGA-784

Description of Change:Renesas is adding Daeduck Korea as an alternate substrate supplier in addition to the current UMTC and Kinsus. Daeduck has decades of experience and expertise in Flip Chip BGA/CSP

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