Electronic News

HE3621A0500 HE3621A1200 HE3621A2400 HE3621A2410 Improved Packaging for Single-In-Line Reed Relays Pr

■Following our PCN dated 08/31/2023 to announce the improved packaging for Single-In-Line Reed Relays with added EPE foam between tubes inside the inner box as protective wrapping to reduce the risk of

P1 series Signal Relays Product Change Notification (PCN-23-186826)

■Description of Changes Discontinuation of P1 Signal Relays series. The part numbers in the following table will become obsoleted obsolete status . A last me buy opportunity is provided as per the dates

Wafer-fabrication and chip-assembly factories addition for RL78/G23-128KB QFN and LQFP package produ

Description of Change:■Case1: QFN package products▲Wafer fab: Powerchip Semiconductor Manufacturing Corporation PSMC addition■Case2: LQFP package products Case2a: 44pin LQFP assembly in KL Case2b: 32/48/64pin

Notice of Sorting Factory Change for RX23W (QFN/BGA) Products (IMO-AB-23-0100-1)

■Description of Change: We are planning to change the sorting factory as shown below. Factory for the sorting process: ▲Current factory: King Yuan Electronics Co. Ltd hereinafter referred to as KYEC ▲Factory

Additional DCB suppliers for flow S3 and flow E3 modules Customer Notification of PROCESS CHANGE (40

■SUBJECT OF CHANGE: Additional DCB suppliers for flow S3 and flow E3 modules■REASON OF CHANGE: Improve supply chain security■CLASSIFICATION OF CHANGE: Minor for information purpose only no customer acknowledgement

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