Subject: Assembly factory addition and assembly materials addition change for RL78 family LQFP package products Publication Date: 12/29/2021 Effective Date: 3/1/2022 Reason for Change: ▲Stable supply for
Read moreSubject: Assembly sorting factory addition assembly materials addition change and wafer process factory addition for RL78 family LQFP package products Publication Date: 12/27/2021 Effective Date: 3/1/2022
Read more■The products listed below are subject to a product change and will be supplied in a modified revision. Please pass this product information on to your employees and if needed to your customers. This product
Read more■Description of Change: Renesas plans to change bonding-wire to Cu-wire and to add the site of Back-Grinding Assembly and Final Test for the RH850/F1 and D1 series to realize stable supply. From this scheme
Read moreCLASSIFICATION OF CHANGE:Datasheet specification change. DESCRIPTION OF CHANGE:Increase current rating at 40°C Irms from 19 A to 40 A. Add inductance vs. frequency curves and impedance vs. frequency curves.
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