2201251177 Errata Release for EFR32FG23 v0.6, EFR32ZG23 v0.5 and ZGM230S v0.2(2022-01-25-1177)
Description of Change ■Silicon Labs is pleased to announce the release of the following errata versions for EFR32FG23 EFR32ZG23 and ZGM230S devices. ■Release of version 0.6 of the EFR32FG23 errata ■Release
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2201251182 WFM200S v1.2 Datasheet Release(2022-01-25-1182)
Description of Change ■Silicon Labs is pleased to announce the release of WFM200S v1.2 datasheet version. Reason for Change ■Updated certifications to reflect UK specifics: Section 1. Features List and
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Factory addition and assembly materials change for RL78 family LQFP package products (MCP-AC-22-0004
Description of Change: ■Wafer process factory: Renesas Semiconductor Manufacturing Saijo addition ■Assembly/sorting factory: Renesas Semiconductor Beijing Co. Ltd RSB addition ■ Refer to the difference
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2201251131 End of Life Notification for BLE112 Modules(2022-01-18-1131)
Description of Change ■Silicon Labs announces an End of Life EOL and Last Time Buy LTB for BLE112 Modules. ■Existing customers may place LTB orders per the key dates above and guidelines listed in this
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Addition of wafer test factory for RL78/F13, F14 series(AMBD-2022-0005)
Description of Change: ■Renesas plans to add our wafer test factory for stable supply of the RL78/F13 F14 series. We would highly appreciate it if you would check the following changes and approve our
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