Product Identification: ■all TS68C429 references Reason for Change: ■Manufacturing Location Change Description: ■Given the closure of MHS wafer process line the product is transferred on ST HCMOS04T 0.8um
Read moreProduct Identification: ■PC837x P2020 P3041 P2041 P4080 series Reason for Change: Manufacturing Location Change Description: ■e2v is introducing and qualifying a new subcontractor for the deballing/reballing
Read moreProduct Identification: PC745BVGH350LE Reason for Change: Processing Change Description: ■This PC745 wafer die exists in 2 variants exhibiting slower or faster behaviour. The adjustment consists in die
Read moreProduct Identification: ■all PC8572 rev. E references: PC8572ELVZFAVNE Reason for Change: Processing Material Change Description: ■Previous lid of package FCPBGA 1023 is fully fitted while new lid will
Read moreProduct Identification: ■Affected Part Numbers PC X 8548EFZFUAUJD PC8548EMZFAUJD-EP Reason for Change: Manufacturing Location Material Change Description: ■The assembly line for PC8548 is changing from
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