Topic: The reason of packing label change In order to improve management and traceability HYCON Technology Corporation upgrade label system and introduce 1D and 2D bar code. Description: Label change description
Read moreDescription of Change: ■Renesas is adding Unisem Malaysia as an alternate assembly location for VFQFPN packages. Unisem has been qualified by Renesas as an approved Assembly location. Refer to below table
Read more■This product may have Risk of electric shock due to secondary electrical components assembly. ■This product contains external cables with insulation materials which are recommended to be treated separately
Read moreRogers Corporation would like to provide an update to our previous communication from September of 2021 Update: ■Rogers is pleased to announce the availability of our RO4360G2™ with Arsenic Free Cu foil
Read moreThis PCN is being issued to notify customers that products listed below will no longer be available from Diodes Incorporated. For select products on this PCN recommended replacement parts are being offered
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