AllaboutComponents

MSL Re-Classification for listed Renesas MSOP and nSOIC products Product Change Notice (PCN22018)

■Description of Change: This is to inform you that Renesas will change Moisture Sensitive Level MSL Classification from MSL 2 and 3 to MSL 1 for listed Renesas MSOP Mini Small Outline Package and nSOIC

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Product Change of the packing quantity of LRP12 3mΩ and LRP12..A 3mΩ Resistor PCN (220601)

Product Affected: ■LOW OHM Metal Strip Chip Resistor –LRP Series ■Automotive Grade Low Ohm Metal Strip Chip Resistor-LRP..A Series DESCRIPTION AND PURPOSE OF CHANGE: ■For the convenience of production

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”EOL” product list for Renesas Electronics MCU development tools

We would like to hereby request your kind understanding and acceptance of the following EOL End Of Life announcement due to the change of market situation or the discontinuance of component part. Please

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Notification of Marking/Label Change with SAP Go-alive for Power Discrete Products

This is a notification letter to state that Littelfuse will change the Marking and Label format for some of our Power Discrete Products after SAP Go-alive. There will be no change on product fit form function

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Site addition of Final Test, Visual-Inspection and Packing Process for the RH850/F1L series Product

Description of Change: ■Renesas plans to add the site of Final Test Visual-Inspection and Packing Process for the RH850/F1L series Only LQFP100pin and 144pin to realize stable supply. We would highly appreciate

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