Electronic News

MCM-13917：Addition of Polyimide Layer on ASIC die [MLX90817DBx]

Description of change■Old: No Polyimide layer■New: Additional Polyimide layer on ASIC die Reason/motivation for change■Polyimide protection to increase robustness on assembly process. Internal lessons

MCM-17305：Active Second Source Wafer Fab Foundry XFAB Corbeil [MLX81344]

■Description of change Old Wafer Fab Location: Current released Wafer Fab Location: XFAB Kuching Malaysia New Wafer Fab Location: Current released Wafer Fab Location: XFAB Kuching Malaysia XFAB Corbeil

LFPCN2306001-1 Change of delivery label format REV1 Updated E2, E3, V1 and V2 package

To our valued customers and partners This is the updated Rev1 for E2 E3 V1 and V2 packages to reflect last updated label changes.Littelfuse would like to notify you about the change of delivery labels

LFPCN_PG0176 Label legend addition in SLC fuses

We would like to inform there is a change on SLC fuse label adding 170 VDC as shown on label image.There is not impact on Fit Form or Function.Effective date: March 2024. This is a running change. Brand

PCN # ESW490-57 – End of Life (EOL) of Diode Products Using SONICs-Glass Passivated Chips

■To our valued customers ■Littelfuse wants to inform you that we will discontinue six diode products utilizing SONICs-Glass Passivated chips.■Please refer to the appendix for affected and alternative part

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