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Datasheet Change for the Listed Intersil TW8836* Products (PA16083)

■Description of Change: This advisory is to inform you that Intersil has made corrections to the datasheet associated with the listed Intersil TW8836 Products. Details regarding the change are contained

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Datasheet and Wafer Fabrication Site Change for the Listed Intersil EL4340* (PCN17045)

■Description of Change: This notice is to inform you that Intersil has qualified the NXP Semiconductor facility in Nijmegen Netherlands for wafer fabrication of the EL4340 HS6 technology product. The data

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Alternate bond wire material and assembly facility of the listed Renesas QFN packaged products (PCN2

■Description of Change: Alternate bond wire material and assembly facility of the listed Renesas QFN packaged products - UTAC Thai Ltd. Bangkok Thailand UTL ■List of changes : Table 1 – Adding UTL as alternate

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Datasheet specification change for Listed Intersil ISL68144* Products (PCN17034)

■Description of Change: This notice is to inform you that Intersil has updated ISL68144 datasheet. Details regarding the change are contained on the following page. ■Reason for Change: The change aligns

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Datasheet specification change for Listed Intersil ISL68147* Products (PCN17035)

■Description of Change: This notice is to inform you that Intersil has updated ISL68147 datasheet. Details regarding the change are contained on the following page. ■Reason for Change: The change aligns

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