■Littelfuse would like to notify you about the transfer of the backend manufacturing of our modules in E3 package to our Outsourced Semiconductor Assembly and Test (OSAT) factory in Laguna, Philippines.
■This OSAT facility, a Littelfuse Back End partner since many years, build in mass production E3 products for Littelfuse already. This transfer refers to all our E3 products, which have only been built in our Lampertheim facility so far until now.
■Our clear focus being to bring high levels of service to our customers and quality products to support future growth of the power semiconductor business.
■Please find enclosed all details related to this PCN.
■Important information for your attention and according to JEDEC STANDARD “JESD46”:
●Please acknowledge receipt of this PCN. In your acknowledgement, you can grant approval or request additional information.
●Littelfuse will assume the change is acceptable if no acknowledgement is received within 30 days from the date of this PCN. Lack of any additional response within 90 days of PCN issuance further constitutes acceptance of change.

Brand of Product：	Littelfuse
Part#：	MDMA450U1600PT-PC 、 MDMA450U1600PTEH-PC 、 MDMA660U1600PTEH 、 MDMA660U1600PT-PC 、 MDMA660U1600PTEH-PC 、 MDMA900U1600PTEH 、 MDMA900U1600PT-PC 、 MDMA900U1600PTEH-PC 、 MDNA600U2200PT-PC 、 MDNA600U2200PTEH-PC 、 MIXG120W1200PTEH 、 MIXG180W1200PT 、 MIXG180W1200PT-PC 、 MIXG180W1200PTEH-PC 、 MIXG240W1200PTEH 、 MIXG240W1200PT-PC 、 MIXG240W1200PTEH-PC 、 MIXG240W1200PZ-PC 、 MIXG240W1200PZTEH-PC 、 MIXG240W1200PZTEH 、 MIXA80W1200PTEH 、 MUBW50-17T8 、 MUBW75-17T8 More Part#
Product Category：	Power Modules 、 Bipolar Power Modules 、 IGBT Power Modules 、 Bipolar modules More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	E3
Language：	English Chinese Chinese and English Japanese
Date of Creation：	September 26th, 2023
Version Number：
Data Encoding：	LFPCN230926
Data Size：	644 KB
Effective Date：	September 26th, 2023
Type of Change：	Assembly Location Transfer