●Outline of Changes
■Object: RA2E1
▲Wafer-fabrication: Renesas Semiconductor Manufacturing Co., Ltd., Kawashiri factory
▲Chip-assembly: Renesas Semiconductor (Beijing) Co., Ltd (RSB)
▲Package types: 7x7mm 32pin LQFP
■Wafer fabrication factory addition: Powerchip Semiconductor Manufacturing Corporation (PSMC)
▲Assembly factory addition: Greatek Electronics Inc.（Greatek）
■Specification differences:
▲Wafer process: sufficiently equivalent process was ported from Kawashiri factory.
▲Assembly materials: Lead-frame, Die-mount paste, and Mold-resin are certificated at each facility.
■Package outline:
▲No change on the foot-print geometry
■Marking:
▲Marking characters appears slightly different in the font type.
■Product specification/characteristics
▲No change
■Product qualification/reliability
▲No impact

Brand of Product：	Renesas
Part#：	RA2E1 More Part#
Product Category：	MCU More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	LQFP
Language：	English Chinese Chinese and English Japanese
Date of Creation：	Sep/30/2022
Version Number：	Ver. 1.0
Data Encoding：	MCP-AB-22-0086
Data Size：	1.3 MB