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CN74-2021–CMV2K and CMV4K plain glass dicing change

CN74-2021–CMV2K and CMV4K plain glass dicing change

Post time:2024-06-05 15:24:55

Poster:Innovo Technology

From:Network

●Dear Customer,
■Please be informed that ams AG,intends to use a different dicing process and chamfering process to produce glass lids at our supplier, due to high load on the current process line. Please rest assured that the form, fit and function of the sensors for your use will remain the same.

ams AG

CMV2000-2E12M1LP 、 CMV2000-2E12M1PP 、 CMV2000-2E5C1LP 、 CMV2000-2E5C1PP 、 CMV2000-2E5M1CP 、 CMV2000-2E5M1LP 、 CMV2000-2E5M1PP 、 CMV2000-3E5C1PP 、 CMV2000-3E5M1LP 、 CMV2000-3E5M1PP 、 CMV2000-3E12M1LP 、 CMV2000-3E12M1PP 、 CMV4000-2E12C1PP 、 CMV4000-2E12M1LP 、 CMV4000-2E12M1PP 、 CMV4000-2E5C1LP 、 CMV4000-2E5C1PP 、 CMV4000-2E5M1LP 、 CMV4000-2E5M1PP 、 CMV4000-3E5C1LP 、 CMV4000-3E5C1PP 、 CMV4000-3E5M0PN 、 CMV4000-3E5M1LP 、 CMV4000-3E5M1PN 、 CMV4000-3E5M1PP 、 CMV4000-3E12M1LP 、 CMV4000-3E12M1PP

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CMOS image sensor

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PCN/EOL

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August 26, 2021

CN74-2021

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