CN74-2021–CMV2K and CMV4K plain glass dicing change
Post time:2024-06-05 15:24:55
Poster:Innovo Technology
From:Network
●Dear Customer,
■Please be informed that ams AG,intends to use a different dicing process and chamfering process to produce glass lids at our supplier, due to high load on the current process line. Please rest assured that the form, fit and function of the sensors for your use will remain the same.
ams AG | |
CMV2000-2E12M1LP 、 CMV2000-2E12M1PP 、 CMV2000-2E5C1LP 、 CMV2000-2E5C1PP 、 CMV2000-2E5M1CP 、 CMV2000-2E5M1LP 、 CMV2000-2E5M1PP 、 CMV2000-3E5C1PP 、 CMV2000-3E5M1LP 、 CMV2000-3E5M1PP 、 CMV2000-3E12M1LP 、 CMV2000-3E12M1PP 、 CMV4000-2E12C1PP 、 CMV4000-2E12M1LP 、 CMV4000-2E12M1PP 、 CMV4000-2E5C1LP 、 CMV4000-2E5C1PP 、 CMV4000-2E5M1LP 、 CMV4000-2E5M1PP 、 CMV4000-3E5C1LP 、 CMV4000-3E5C1PP 、 CMV4000-3E5M0PN 、 CMV4000-3E5M1LP 、 CMV4000-3E5M1PN 、 CMV4000-3E5M1PP 、 CMV4000-3E12M1LP 、 CMV4000-3E12M1PP More Part# | |
CMOS image sensor More | |
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PCN/EOL More | |
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Please see the document for details | |
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English Chinese Chinese and English Japanese | |
August 26, 2021 | |
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CN74-2021 | |
131 KB |