CMV2000 LCC PCN19-2021 CMV2000 LCC dry bake procedure implementation
Post time:2024-06-05 15:20:56
Poster:Innovo Technology
From:Network
■Please be informed about the upcoming change on the CMV2000 LCC.
■Change Description
▲Our CMV2000 LCC sensors are currenty packed into JEDEC trays. In order to ensure the continuous improvement of our CMV2000 product family, ams AG will implement a dry baking procedure to comply with MSL 3 JEDEC standards.
■Impact on packing&shipment
▲A new packaging specification QTY-1258/1259 has been reviewed accordingly. A new label will be implemented reflecting MSL3 packaging.
ams AG | |
CMV2000 LCC 、 301800004 、 301800005 、 CMV2000-2E5M1CA QA 、 CMV2000-2E5M1CP QA More Part# | |
sensors More | |
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PCN/EOL More | |
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Please see the document for details | |
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English Chinese Chinese and English Japanese | |
April 15, 2021 | |
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PCN19-2021 | |
99 KB |