Migration of PC5674F to TSMC wafer fab and Copper Wirebond Product Change Notification (GC183122)
Post time:2024-06-05 15:54:37
Poster:Innovo Technology
From:Network
●Product Identification: PC5674FF3MZP3
●Reason for Change: Manufacturing Location; Material
●Change Description:
■In order to rationalize its procurements, Teledyne e2v aligns with NXP announcement ref. 16151.
◆The primary NXP wafer manufacturing site transfer to TSMC14 will improve ability to meet customer demand.
◆The transfer from Gold to Copper wire is required to standardize manufacturing flows and mitigate against raw material cost increases
TELEDYNE E2V | |
PC5674F 、 PC5674FF3MZP3 、 PC5674FK4MZP3 More Part# | |
More | |
More | |
PCN/EOL More | |
More | |
Please see the document for details | |
More | |
More | |
| |
English Chinese Chinese and English Japanese | |
25 September 2018 | |
Rev L | |
GC183122 | |
180 KB |