■Description of Change:
●Renesas is adding Carsem, Malaysia as an alternate Wafer Test, Final Test and Backend Location for the select part#. REPG, Malaysia is the current location.
●This change will allow flexibility to ship from either facility and will provide the increased capacity, flexibility and shorter lead time to meet market demand. There is no change in the Test and Backend processing flows. Load boards and test programs are the same at both qualified facilities. Renesas has completed the electrical test correlation and based on the test results we do not anticipate any impact on device performance. The testing is fully compatible and transferrable between the test facilities with no change to the test coverage.
■Affected Product List: IMX3102-Y1B000NCG, IMX3102-Y1B000NCG8, IMX3112-Y1B000NCG, IMX3112-Y1B000NCG8, IMX3112-Y2B000NCG, IMX3112-Y2B000NCG8.
■Reason for Change: To provide increased capacity.
■Impact on Fit, Form, Function, Quality & Reliability: The change will have no impact on the form, fit, function, quality, reliability and environmental compliance of the products.
■Product Identification: Traceability to the Test and Backend location is available on request.
■Qualification Status: Electrical characterization completed successfully. Refer Appendix A
■Sample Availability Date: 8/18/2022
■Device Material Declaration: Not applicable

Brand of Product：	Renesas
Part#：	IMX3102-Y1B000NCG 、 IMX3102-Y1B000NCG8 、 IMX3112-Y1B000NCG 、 IMX3112-Y1B000NCG8 、 IMX3112-Y2B000NCG 、 IMX3112-Y2B000NCG8 More Part#
Product Category：	More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	8/18/2022
Version Number：
Data Encoding：	PCN220024
Data Size：	407 KB