●Product Description & Replacement:
■Due to our supplier’s discontinuation of the CBGA package version of the PC7410 microprocessor, e2v is announcing the end-of-life of these part-numbers that e2v up-screens from Freescale’s commercial products.
■Customer using the PC7410 microprocessor in either CBGA or CI-CGA packages may migrate to the HITCE Ceramic BGA package version which remains fully available. The HITCE version (GH package code) offers the same fit and function as the upscreened CBGA package version (GU package code). Also, the GH package is providing greater board-level reliability when soldered on the PCB and submitted to temperature cycles. Consequently, the HITCE package parts can also be used as a replacement for the columnized CI-CGA version (GSU package code).
■The PC7410 in HITCE package has been fully qualified for operations up to military temperatures (-55°C to +125°C), and is in full production. Reliability data is available upon request.
■The list of all affected part-numbers in CBGA and CI-CGA, as well as suggested replacement part-numbers in HITCE is attached in Appendix A of this EOL notification.
●Reason for EOL:
■This EOL is subsequent to the discontinuation of the CBGA package versions from Freescale.

Brand of Product：	TELEDYNE E2V
Part#：	PC7410 、 PC7410VGU400LE 、 PC7410VGU450LE 、 PC7410VGU500LE 、 PC7410MGU400LE 、 PC7410MGU450LE 、 PC7410MGU500LE 、 PC7410VGU400NE 、 PC7410VGU450NE 、 PC7410MGU400NE 、 PC7410MGU450NE 、 PC7410VGSU400LE 、 PC7410VGSU450LE 、 PC7410VGSU500LE 、 PC7410VGSU400NE 、 PC7410VGSU450NE 、 PC7410MGSU400LE 、 PC7410MGSU450LE 、 PC7410MGSU500LE 、 PC7410MGSU400NE 、 PC7410MGSU450NE 、 PC7410VGH400LE 、 PC7410VGH450LE 、 PC7410VGH500LE 、 PC7410MGH400LE 、 PC7410MGH450LE 、 PC7410MGH500LE 、 PC7410VGH400NE 、 PC7410VGH450NE 、 PC7410MGH400NE 、 PC7410MGH450NE More Part#
Product Category：	microprocessor More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	CBGA;CI-CGA;HITCE Ceramic BGA
Language：	English Chinese Chinese and English Japanese
Date of Creation：	July 31st, 2007
Version Number：
Data Encoding：	GE073101
Data Size：	58 KB