All devices manufactured in the TO-72 case Product / Process Change Notice (239)
Post time:2024-06-05 16:18:54
Poster:Innovo Technology
From:Network
■Parts Affected:
●All devices manufactured in the TO-72 case.
■Extent of Change:
●Additional plating facility.
■Reason for Change:
●As part of Central Semiconductor’s supply chain risk mitigation initiative, in an effort to ensure an undisrupted supply of product, an additional plating facility is being added for the referenced product family. Product specifications, quality and reliability are not impacted by this addition.
■Effect of Change:
●This addition does not affect the fit, form or function of devices.
■Qualification:
●Solderability test data available upon request.
■Earliest Effective Date of Change:
●June 30, 2022
■Sample Availability:
●Please contact your salesperson or manufacturer’s representative for samples.
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TO-72 | |
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June 30, 2022 | |
R0 | |
239 | |
111 KB |