●Subject: Data Sheet Specification Change for Intersil Product ISL59534IKEZ
●This advisory is to inform you that Intersil has updated the data sheet specification for the listed ISL59534IKEZ product. The change to θJA for the HBGA (Heatsink Ball Grid Array) package in the Thermal Information section aligns the data sheet with the product characteristics.
●Data sheet specification changes for θJA are as follows:
■Thermal Resistance: 356p HBGA
■Current Value: 4.7 – 18* °C/W
■New Value: 24°C/W

Brand of Product：	Intersil
Part#：	ISL59534IKEZ More Part#
Product Category：	More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	October 11, 2011
Version Number：
Data Encoding：	PA11105
Data Size：	132 KB
Effective Date：	October 11, 2011
Type of Change：	Data Sheet Specification Change