Product Change Notification - LIAL-10JYTJ941
Post time:2024-06-05 15:06:59
Poster:Innovo Technology
From:Network
●Product Category:
■Driver / Interface ICs
●Description of Change:
■Qualification of NSEB as a new assembly site for selected HV5523 and HV5623 device families available in 44L WQFN (7x7x0.8mm) package using Au wire.
●Reason for Change:
■To improve manufacturability by qualifying NSEB as a new assembly site.
MICROCHIP | |
HV5523 、 HV5623 More Part# | |
Driver ICs 、 Interface ICs More | |
More | |
PCN/EOL More | |
More | |
Please see the document for details | |
More | |
More | |
WQFN | |
English Chinese Chinese and English Japanese | |
06 Mar 2020 | |
| |
LIAL-10JYTJ941 | |
50 KB |