●PCN Title: Manufacturing Site Alternate - Qualification of Raytek for PbF wafer bump process for additional commercial device, EPC2070
●Product Identification:The following released to sales part numbers will be impacted by this change:EPC2070
●Description of Change:
■EPC announces the qualification of RAYTEK for PbF (lead free) wafer bump process for commercially released device, EPC2070. There will be no change in manufacturing technology or to the package dimensions. This change does not affect the form, fit, or function of the product as defined in the datasheet.
■Successful qualification testing of the RAYTEK facility was performed to ensure product quality and reliability requirements are met or exceeded. RAYTEK is an existing qualified supplier for other EPC devices including commercial and AEC products. Additional qualification information can be provided upon request.
■RAYTEK will begin production of the EPC2070 on or after June 6, 2021. Products with date code 2230 and afterward could be produced by RAYTEK. During the transition period customers may receive shipments from any approved EPC assembly site. Shipment of such products to a customer will only occur after the customer PCN is signed off.

Brand of Product：	EPC
Part#：	EPC2070 More Part#
Product Category：	More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	November 29, 2022
Version Number：
Data Encoding：	PCN22101
Data Size：	161 KB