Wafer-fabrication and chip-assembly factories addition for RA2E1 32pin QFN and 32pin LQFP package pr
Post time:2024-06-05 16:31:49
Poster:Innovo Technology
From:Network
●Renesas Electronics Corp. would like to hereby request your kind understanding and approval for this subject.
●We would like to announce PCN that intends to offer more flexible supply chains of our MCU products where the wafer-fabrication facility and the chip-assembly sites (with slight package material change) to be added for RA2E1 32pin QFN and 32pin LQFP package products. No impact on characteristics and reliability for this notice.
●Applicable products
■RA2E1: 5x5mm 32pin QFN, 7x7mm 32pin LQFP
●Schedule
■Sample acceptance deadline is at the end of December 2022.
■In principle, we will ship after Jan/31, 2022 onward.
■ES samples will be provided for functionality check where there is no functionality difference between ES sample and MP version.
| Renesas | |
| RA2E1 More Part# | |
| MCU More | |
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| PCN/EOL More | |
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Please see the document for details | |
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| QFN;LQFP | |
| English Chinese Chinese and English Japanese | |
| September 30, 2022 | |
| Revision 1 | |
| MCP-AC-22-0032 | |
| 209 KB |