■Description of Change:
Alternate assembly facility of the listed Renesas nSOIC packaged products
● Advanced Semiconductor Engineering, Chung Li, Taiwan ROC (ASECL)
● Greatek Electronics Inc., Taiwan R.O.C (Greatek)
■List of changes :
● Adding ASECL and Greatek as alternate assembly site,
● Wire material change from Gold to Copper
● Standardize Moisture Sensitivity Level from MSL1, 3 to MSL3.
●This notice is to inform you that Renesas will begin using Copper Wire bond material at ASECL and Greatek facilities for the Listed Renesas narrow Small Outlined Integrated Circuit (nSOIC) products. The Copper bond wire is an alternate to the gold bond wire currently used for assembly of the listed products.
■Reason for Change:
ASECL and Greatek are existing assembly supplier for Renesas. Adding assembly site will expand current capabilities and capacities to optimize Renesas’s ability to meet customer’s delivery requirements. Both ASECL and Greatek facilities are ISO9001:2015 and IATF 16949:2016 certified. ASECL and Greatek are existing assembly supplier for high volume assembly of nSOIC packaged products with both gold and copper bond wire material.
■Impact on fit, form, function, quality & reliability:
The assembly qualification plan is designed using JEDEC and other applicable industry standards to confirm there is no impact to form, fit, function or interchangeability of the product. A summary of the qualification plan and results are included for reference. Please refer Appendix B. The remainder of the manufacturing operations (wafer fabrication, package level electrical test, etc) will continue to be processed to previously established manufacturing flow.
Products assembled with Copper bond wire are classified as Moisture Sensitivity Level Three (MSL3). As such, the affected devices will be packed, labeled and shipped as MSL3 upon implementation of the changes outlined in the PCN.

Brand of Product：	Renesas
Part#：	ISL84544IBZ 、 ISL84544IBZ-T 、 ICL3232CBNZ 、 ICL3232ECBNZ-TS2800 、 ICL3232IBNZ-T 、 ICL3232CBNZ-T 、 ICL3232EIBNZ 、 ICL3232IBNZ-T7A 、 ICL3232ECBNZ 、 ICL3232EIBNZ-T 、 ICL3232ECBNZ-T 、 ICL3232IBNZ More Part#
Product Category：	Alternate bond wire material 、 assembly facility More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	10/6/2022
Version Number：
Data Encoding：	PCN22030
Data Size：	180 KB