Data Sheet and Wafer Fabrication Site Change for Intersil Product EL9115* (PCN11102)
Post time:2024-06-05 16:59:06
Poster:Innovo Technology
From:Network
■This notice is to inform you that Intersil has qualified the NXP Semiconductor facility in Nijmegen, the Netherlands for wafer fabrication of the EL9115* HS6 technology products. The change in wafer fabrication site is necessary as the NXP facility in Fishkill, New York has discontinued manufacturing operations. The HS6 wafer fabrication operations have been relocated from the NXP Fishkill to the NXP Nijmegen facility. The data sheet has been updated to align the specification with the characteristics of the product (silicon) fabricated at the NXP Nijmegen facility. The old and new DC Electrical Specifications tables with the changed areas shaded in yellow are included on the following pages of this notice. As of this notice, the data sheet updates and product qualification activities are complete.
■The NXP Nijmegen facility is ISO 9001:2008 and ISO/TS 16949:2002 certified. The product and site qualification plans are designed using JEDEC and other applicable industry standards to confirm form, fit, function, or interchangeability of the product. A summary of the qualification results is included for reference. The remainder of the manufacturing operations will continue to be processed to previously established conditions and systems. Product affected by this change is identifiable via Intersil’s internal traceability system.
■Intersil will take all necessary actions to conform to agreed upon customer requirements and to ensure the continued high quality and reliability of Intersil products being supplied. Customers may expect to receive product from either the current or the newly qualified sites and screened to the updated data sheet beginning ninety days from the date of this notification or earlier with approval.
Intersil | |
EL9115* 、 EL9115ILZ 、 EL9115ILZ-T7 、 EL9115ILZ-T7S2714 、 EL9115ILZS2714 、 EL9115ILZ-T13 、 EL9115ILZ-T7R5504 、 EL9115ILZR5504 More Part# | |
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PCN/EOL More | |
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Please see the document for details | |
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English Chinese Chinese and English Japanese | |
October 3, 2011 | |
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PCN11102 | |
427 KB |