AllaboutComponents

Change in the packaging of CC-Link system built-in I/O modules (manufactured in April 2019 and after

Change in the packaging of CC-Link system built-in I/O modules (manufactured in April 2019 and after

Post time:2024-06-05 16:24:44

Poster:Innovo Technology

From:Network

●We will inform you of the change in the packaging of CC-Link system built-in I/O modules.
●The strength of the packaging remains the same, and there is no impact on the product functions and performance due to this change
●Reason for the change:
To reduce the environmental load by changing cushioning material to cardboard as part of resource saving activities (ISO 14001)

MITSUBISHI ELECTRIC

AJ65MBTL1N-16D 、 AJ65MBTL1N-16DT 、 AJ65MBTL1N-16T

More

Part#

CC-Link system built-in I/O module

More

More

PCN/EOL

More

More

Please see the document for details

More

More

English Chinese Chinese and English Japanese

March 2019

Version. A

FA-A-0276-A

77 KB