Change in the packaging of CC-Link system built-in I/O modules (manufactured in April 2019 and after
Post time:2024-06-05 16:24:44
Poster:Innovo Technology
From:Network
●We will inform you of the change in the packaging of CC-Link system built-in I/O modules.
●The strength of the packaging remains the same, and there is no impact on the product functions and performance due to this change
●Reason for the change:
To reduce the environmental load by changing cushioning material to cardboard as part of resource saving activities (ISO 14001)
MITSUBISHI ELECTRIC | |
AJ65MBTL1N-16D 、 AJ65MBTL1N-16DT 、 AJ65MBTL1N-16T More Part# | |
CC-Link system built-in I/O module More | |
More | |
PCN/EOL More | |
More | |
Please see the document for details | |
More | |
More | |
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English Chinese Chinese and English Japanese | |
March 2019 | |
Version. A | |
FA-A-0276-A | |
77 KB |