SOD-323 SOD-323 package products Process Change Notice PCN EA202403020
Post time:2024-06-05 17:16:04
Poster:Innovo Technology
From:Network
●变更内容
■为了提高市场竞争力，现部分 SOD-323 封装产品焊线由金线变更为铜线，变更后产品可靠性考核通过。
■材料 XRF 检测结果 (针对材料变更)：不适用
■成品 XRF 检测结果 (针对产品原物料变更及制程变更)：不适用
●Change Contents:
■In order to improve market competitiveness, the solder wire of some SOD-323 package products changed from Au wire to Cu wire, and the product reliability assessment has passed after the change.
■Material XRF Test Result (for material change): Not Applicable
■Product XRF Test Result (for main material & process change): Not Applicable
| JSCJ | |
| ESDBL15VD3 、 ESDBL18VD3 、 ESDBL36VD3 、 ESDBM12VD3 、 ESDBM24VD3 、 ESDBP5VOD3 、 ESDBW18VD3 、 MESDBM12VD3 、 MESDBM24VD3 More Part# | |
|
More | |
|
More | |
| PCN/EOL More | |
|
More | |
Please see the document for details | |
|
More | |
|
More | |
| SOD-323 | |
| English Chinese Chinese and English Japanese | |
| 2024/3/27 | |
|
| |
| EA202403020 | |
| 494 KB |