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The CP710V wafer process Product / Process Change Notice (235)

The CP710V wafer process Product / Process Change Notice (235)

Post time:2024-06-05 16:01:28

Poster:Innovo Technology

From:Network

■Parts Affected:
●The CP710V wafer process
■Extent of Change:
●Wafer diameter has changed from 5” to 6”. In order to optimize the wire bond and die attach processes, slight adjustments were also made in the metallization thicknesses (see Table # 1).
■Reason for Change:
●Foundry process change
■Effect of Change:
●This change does not affect the form, fit, or function of any device; however, gross die quantities per wafer have increased.
■Qualification:
●Standard evaluation and qualifications were completed resulting in no performance differences compared to current product.
■Effective Date of Change:
●April 28, 2022

Central Semiconductor

CP710V-BC393-WN 、 CP710V-CEN1153-CT 、 CP710V-CEN1153-WN 、 CP710V-CEN1393-CTJ 、 CP710V-CEN1393-WN 、 CP710V-CJD350-CT 、 CP710V-CJD350-WN 、 CP710V-CMPTA94-CT 、 CP710V-CMPTA94-WN 、 CP710V-CMPTA96-CT 、 CP710V-CZTA94-CT 、 CP710V-HCEN2031-CM 、 CP710V-HCEN2031-WN 、 CP710V-KCEN2032-CM 、 CP710V-KCEN2032-WN 、 CP710V-MPSA92-CM 、 CP710V-MPSA92-CT20 、 CP710V-MPSA92-WN 、 CP710V-2N5415-CT 、 CP710V-2N5415-CT20 、 CP710V-2N5415-WN 、 CP710V-2N5416-CT 、 CP710V-2N5416-WN 、 CP710V-2N6520-CT 、 CP710V-2N6520-WN 、 CP710V 、 CP710V-CMPTA96-WN 、 CP710V-MPSA92-CT 、 CP710V-HMPSA92-CM

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wafer

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PCN/EOL

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April 28, 2022

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235

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