PCN_171031801_20220215 WPME-VDLM-171031801 Product / Process Change Notification (PCN)
Post time:2024-06-05 15:46:15
Poster:Innovo Technology
From:Network
●Affected Series:WPME-VDLM-171031801
●DESCRIPTION AND PURPOSE OF CHANGE:
■To meet current customer demands, Würth Elektronik has updated the thermal derating diagram in the data sheet to ease reader comprehension.
To improve the processability, Würth Elektronik has changed the molding compound and internal solder paste.
In line with internal standardization, the matchcode for this product has been updated.
All products with date code 2022-01-03 or later, will be affected by the mold compound and solder paste change.
All products are retroactively and prospectively affected by this change of thermal derating and match code.
There will be no change in form, fit, quality or reliability of the product.
●DETAIL OF CHANGE:
■The thermal derating diagram of the module has been updated to increase the ease of reader comprehension. The thermal derating has been adjusted and will require attention of the user to ensure it is operating within the allowable range indicated.
The molding compound section in the package specification has been updated.
The product matchcode has been changed from VDRM to WPME-VDLM.
●RELIABILITY / QUALIFICATION SUMMARY:
■Thermal measurements were performed to validate the new derating curve indicated in the data sheet.
■The following reliability tests were performed to verify the robustness of the new mold compound and solder paste:
▲Five times reflow / WE Standard
▲High temperature storage lifetime / JESD22-A103
▲Low temperature storage lifetime / JESD22-A119A
▲Temperature cycling with preconditioning / JESD22-A104/-A113G
▲Unbiased humidity and stress test / JESD22-A118B
▲Mechanical vibration test / MIL-STD-202 Method 204
▲Mechanical shock test / MIL-STD-202 Method 213
■All test results indicated satisfactory reliability performance.
WURTH ELEKTRONIK | |
WPME-VDLM-171031801 More Part# | |
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November 19, 2021 | |
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PCN_171031801_20220215 | |
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