MSL reclassification and Alternate assembly facility of the listed Renesas SCQFN packaged products P
Post time:2024-06-05 16:26:44
Poster:Innovo Technology
From:Network
■Description of Change:
●Alternate assembly facility of the listed Renesas SCQFN packaged products
◆UTAC Thai Ltd., Bangkok, Thailand (UTL)
■List of changes:
●This notice is to inform you that Renesas will begin using alternate assembly site and standardize MSL. Below summarizes the details of changes :
◆Moisture Sensitive Level (MSL) reclassified from MSL 1 and 2 to MSL 3 as part of packing standardization for listed Renesas SCQFN listed in Appendix A, Table 1. Listed devices will be shipped and labelled as MSL 3 with dry packing.
◆Renesas Electronics America Inc. will begin to use UTL as alternate assembly facility of Step Cut Quad Flat No Lead (SCQFN) product with Copper (Cu) Wire. Affected devices are listed in Appendix A, Table 2.
■Reason for Change:
●Adding assembly site will expand current capabilities and capacities to optimize Renesas's ability to meet customer's delivery requirements. UTL is ISO9001:2015 and IATF 16949:2016
certified.
■Impact on fit, form, function, quality & reliability:
●The assembly qualification plan is designed using JEDEC , AEC and other applicable industry standards to confirm there is no impact to form, fit, function or interchangeability of the product. The remainder of the manufacturing operations (wafer fabrication, package level electrical test, etc) will continue to be processed to previously established manufacturing flow.
Renesas | |
RAA2710504R13HNP#HA0 、 RAA2710504R1EHNP#HA0 、 RAA279971E3HNP#AA0 、 RAA271082A4HNP#AA0 、 ISL78083ARZ 、 ISL78083ARZ-T 、 ISL78083ARZ-T7A 、 ISL78083ARZ-TR5869 、 ISL78083ARZR5869 、 RAA279971D3HNP#AA0 、 RAA279971E3HNP#HA0 、 RAA279972C3HNP#AA0 、 RAA279972C3HNP#HA0 More Part# | |
More | |
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PCN/EOL More | |
More | |
Please see the document for details | |
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SCQFN | |
English Chinese Chinese and English Japanese | |
08/03/2022 | |
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PCN22023 | |
200 KB |