Difference of specification:RL78 family HWQFN products(MCP-AB-22-0050)
Post time:2024-06-05 16:01:20
Poster:Innovo Technology
From:Network
●DIFFERENCE OUTLINE
■Target package:
◆3x3mm 0.5mm pitch 16pin HWQFN
◆4x4mm 0.5mm pitch 24pin HWQFN
◆5x5mm 0.5mm pitch 32pin HWQFN
■Difference points
◆Assembly factory
▲Existing factory: Greatek Electronics Inc. (Greatek)
▲Additional factory: UTAC Thai Limited (UTAC)
◆Sorting factory
▲Existing factory: King Yuan Electronics Co., Ltd (KYEC)
▲Additional factory: UTAC Thai Limited (UTAC)
◆Wafer process
▲Existing factory: Renesas Semiconductor Manufacturing Kawashiri
▲Additional factory: Renesas Semiconductor Manufacturing Saijo
◆Assembly material
▲Lead frame, Die mount paste and Mold resin are used certificated materials.
◆Package outline
▲There is no change in footprint for additional factory products.
▲Please refer to the package outline drawing and dimension comparison for the external
dimensions.
◆Marking
▲Change the marking font.
◆Packing
▲Emboss tape, Reel, Indicator, desiccant, Moisture-proof bag, inner box are used certificated
materials.
◆Storage condition after opening:
▲There is no change.
▲: Within 30°C/ 60%RH/ 168h (JEDEC compliant)
◆Specification and characteristics of product:
▲No impact
◆Quality and reliability:
▲No impact
Renesas | |
RL78 family 、 RL78 More Part# | |
More | |
More | |
PCN/EOL More | |
More | |
Please see the document for details | |
More | |
More | |
HWQFN | |
English Chinese Chinese and English Japanese | |
APRIL. 23. 2022 | |
Rev. 0.1 | |
MCP-AB-22-0050 | |
2.6 MB |