PCN20008A: Conversion to Cu Wire for SmartFusion, IGLOO2, and SmartFusion2 (Addendum)
Post time:2024-06-05 16:23:30
Poster:Innovo Technology
From:Network
●Description
■Microsemi SoC successfully completed the qualification run to convert IGL0O2/SmartFusion2 devices in TQG144 from Au wire to Gold Coated Palladium Copper wire (AuPdCu, also known as AuPCC).
■The qualification run for SmartFusion in FG/FGG256 has been postponed and new expected qualification completion is by March 15, 2021.
■There is no change in assembly site location. SmartFusion devices in FG/FGG256 will remain at UTAC in Dongguan China. IGLOO2/SmartFusion2 devices in TQG144 assembly support will remain at Amkor Philippines.
●Reason for Change
■Conversion to AuPdCu (AuPCC) wire is aligned with the current industry trend. Our assembly vendors have extensive experience in copper bond wire assembly. There is no expected impact in product moisture sensitivity level (MSL), product functionality, performance, quality, or reliability.
■Products assembled with copper wire only use halogen-free materials.
MICROSEMI | |
A2F200M3F-1FG256 、 A2F200M3F-1FG256I 、 A2F200M3F-1FGG256 、 A2F200M3F-1FGG256I 、 A2F200M3F-FG256 、 A2F200M3F-FG256I 、 A2F200M3F-FGG256 、 A2F200M3F-FGG256I 、 M2S005-1TQG144 、 M2S010-1TQG144 、 M2S005-1TQG144I 、 M2S010-1TQG144I 、 M2S005S-1TQG144 、 M2S010S-1TQG144 、 M2S005S-1TQG144I 、 M2S010S-1TQG144I 、 M2S005S-TQG144 、 M2S010S-TQG144 、 M2S005S-TQG144I 、 M2S010S-TQG144I 、 M2S005-TQG144 、 M2S010-TQG144 、 M2S005-TQG144I 、 M2S010-TQG144I 、 M2GL005-1TQG144 、 M2GL010-1TQG144 、 M2GL005-1TQG144I 、 M2GL010-1TQG144I 、 M2GL005S-1TQG144 、 M2GL010S-1TQG144 、 M2GL005S-1TQG144I 、 M2GL010S-1TQG144I 、 M2GL005S-TQG144 、 M2GL010S-TQG144 、 M2GL005S-TQG144I 、 M2GL010S-TQG144I 、 M2GL005-TQG144 、 M2GL010-TQG144 、 M2GL005-TQG144I 、 M2GL010-TQG144I More Part# | |
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English Chinese Chinese and English Japanese | |
September 14, 2020 | |
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PCN20008A | |
930 KB |