●Dear Customer,
■Please be informed about the upcoming change on the method and material used for the packaging of the NanEye2D Dies.
●Change Description
■While transferring the CSP production from IZM (Institute) to our qualified OSAT Xintec, the product MSL classification was updated to MSL3. In light of this update and the aplicable industry standard requirements of packing Moisture Sensitive Devices, AMS introduced a dry baking step for the NanEye2D Dies prior shipment to our clients. As a consequence of this extra step, an update of the current packaging tray to a 4” waffle tray that can sustain the dry baking requirements of 125 degree Celsius for 8h will be implemented.
■Impact on packing & shipment
▲A new packaging specification QTY-1167 has been reviewed accordingly.
■Implementation plan
▲ams AG plans to implement this change by end-July, 2020.

Brand of Product：	ams AG
Part#：	NE2D_CHIP_B&W_SGA 、 NE2D_CHIP_RGB_SGA More Part#
Product Category：	More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	July 3, 2020
Version Number：
Data Encoding：	PCN34-2020
Data Size：	72 KB