■Description of Change:
●Renesas is adding Daeduck, Korea as an alternate substrate supplier in addition to the current UMTC, Taiwan. Daeduck has decades of experience and expertise in Flip Chip BGA/CSP substrates and is ranked among the top 10 worldwide substrate suppliers in terms of revenue.
●There will be no changes to the substrate design, physical dimensions and electrical performance. Daeduck will be exactly the same as UMTC substrate in terms of form, fit and function. Daeduck uses mainstream HVM core and build-up materials for better ‘future availability’. These have equivalent performance as the current materials used by UMTC substrate. Daeduck’s ENEPIG surface finish provides the same protection against corrosion as the immersion Sn to ensure the same level of solder joint quality and reliability.
●Refer to appendix for comparison between the current substrate suppliers versus the newly added substrate supplier.
■Affected Product List: 89HT0832PZCBLG, 89HT0832PZCBLG8, 89HT0832PZCBLGI, 89HT0832PZCBLGI8.
■Reason for Change: To avoid supply shortages by ABF material and manufacturing capacity limitations.
■Impact on Fit, Form, Function, Quality & Reliability: The change will have no impact on the form, fit, function, quality, reliability and environmental compliance of the products.
■Product Identification: Assembly Lot# traceable to the substrate material supplier
■Qualification Status: Completed. Refer Appendix A
■Sample Availability Date:9/30/2022
■Material Declaration: Available on request

Brand of Product：	Renesas
Part#：	89HT0832PZCBLG 、 89HT0832PZCBLG8 、 89HT0832PZCBLGI 、 89HT0832PZCBLGI8 More Part#
Product Category：	More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	8/1/2022
Version Number：
Data Encoding：	PCN220023
Data Size：	111 KB