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Notice of Change in Substrate Materials for TFLGA, LFBGA, and TFBGA Products (IMO-AB-22-0116-2)

Notice of Change in Substrate Materials for TFLGA, LFBGA, and TFBGA Products (IMO-AB-22-0116-2)

Post time:2024-06-05 16:29:04

Poster:Innovo Technology

From:Network

●Changes
■For BGA products manufactured at ATJ Kumamoto and Hakodate, which are OS deployment destinations for the assembly and test, the supply of substrates from SIMMTECH Korea will be ended. We inform you the change in the substrate materials (core material and hole filler material), since materials will be supplied from other substrate manufacturers.

Renesas

H8SX family 、 H8S family 、 RX family 、 H8SX 、 H8S 、 R1LV1616HBG family 、 R1LV1616HBG 、 RZ/T1 、 RZ/T1-M group 、 RZ/T1-M 、 EC-1 、 DSC family 、 DSC 、 RA family 、 SYNERGY 、 SYNERGY family

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PCN/EOL

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Please see the document for details

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TFLGA;LFBGA;TFBGA

English Chinese Chinese and English Japanese

10/7/2022

IMO-AB-22-0116-2

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