Notice of Change in Substrate Materials for TFLGA, LFBGA, and TFBGA Products (IMO-AB-22-0116-2)
Post time:2024-06-05 16:29:04
Poster:Innovo Technology
From:Network
●Changes
■For BGA products manufactured at ATJ Kumamoto and Hakodate, which are OS deployment destinations for the assembly and test, the supply of substrates from SIMMTECH Korea will be ended. We inform you the change in the substrate materials (core material and hole filler material), since materials will be supplied from other substrate manufacturers.
Renesas | |
H8SX family 、 H8S family 、 RX family 、 H8SX 、 H8S 、 R1LV1616HBG family 、 R1LV1616HBG 、 RZ/T1 、 RZ/T1-M group 、 RZ/T1-M 、 EC-1 、 DSC family 、 DSC 、 RA family 、 SYNERGY 、 SYNERGY family More Part# | |
More | |
More | |
PCN/EOL More | |
More | |
Please see the document for details | |
More | |
More | |
TFLGA;LFBGA;TFBGA | |
English Chinese Chinese and English Japanese | |
10/7/2022 | |
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IMO-AB-22-0116-2 | |
284 KB |