Chip process CPD102X, Schottky diodes, wafers,and bare die Product / Process Change Notice (PCN #230
Post time:2024-06-05 15:52:05
Poster:Innovo Technology
From:Network
●Parts Affected: Chip process CPD102X, Schottky diodes, wafers, and bare die.
●Extent of Change: The CPD102Xwafer process has been discontinued and is being replaced with the CPD51V wafer process. See Figures 1 and 2 for details.
●Reason for Change: The CPD102X wafer process has been replaced in order to enhance manufacturing process controls. This change will help ensure an undisrupted supply of product.
●Effect of Change: The CPD51V wafer process meets all electrical specifications of the individual devices listed on the following page.
Central Semiconductor | |
CPD51V 、 CPD102X 、 CEN1267 、 CMDD6263 、 CMKD6263DO 、 CMLD6263C 、 CMLD6263DO 、 CMOD6263 、 CMPD6263 、 CMPD6263A 、 CMPD6263C 、 CMPD6263S 、 CMSD6263 、 CMSD6263A 、 CMSD6263C 、 CMSD6263S 、 CMUD6263AE 、 CMUD6263CE 、 CMUD6263E 、 CMUD6263SE 、 CPD102X-CMPD6263-WR 、 CPD102X-1N5711-WN 、 CPD102X-1N6263-WN 、 CPD102X-CMPD6263-WN 、 CPD102X-CMPD6263-CT More Part# | |
Schottky diodes More | |
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PCN/EOL More | |
More | |
Please see the document for details | |
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SOT-23 Case | |
English Chinese Chinese and English Japanese | |
March 18, 2022 | |
R0 | |
PCN #230 | |
344 KB |