●Parker Chomerics has reached a decision to discontinue THERM-A-FORM™ T644 Cure-in-Place Potting and Underfill Material due to unresolved supply chain constraints that prevent us from assuring a long term and reliable supply. We are notifying you as early as possible to ensure you have ample time to adjust your needs and qualify alternative material.
●This discontinuation affects the following THERM-A-FORM™ T644 part numbers:
■65-00-T644-0045
■65-00-T644-0200
■65-00-T644G-0045
■69-11-43115-T644
●Recommended Alternative Replacement
■Parker Chomerics would have you consider THERM-A-FORM™ CIP 35 Thermally Conductive Cure-In-Place Compound as a possible replacement material. It offers a 3x higher thermal conductivity, a 4x longer shelf life, all at a more competitive price than the outgoing THERM-A-FORM™ T644. Both the discontinued T644 and the recommended replacement CIP 35 offer a 1:1 mix ratio.

Brand of Product：	Parker Chomerics
Part#：	THERM-A-FORM™ T644 、 65-00-T644-0045 、 65-00-T644-0200 、 65-00-T644G-0045 、 69-11-43115-T644 、 THERM-A-FORM™ CIP 35 、 T644 、 CIP 35 、 THERM-A-FORM T644 、 THERM-A-FORM CIP 35 、 65-00-CIP35-0045 、 65-00-CIP35G-0045 、 65-00-CIP35-0200 、 65-00-CIP35-0400 、 65-00-CIP35-1200 、 65-1P-CIP35-5600 、 65-5P-CIP35-10452 More Part#
Product Category：	Cure-in-Place Potting and Underfill Material 、 Thermally Conductive Cure-In-Place Compound More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	November 17, 2020
Version Number：
Data Encoding：
Data Size：	287 KB
Type of Change：	Discontinuation
Effective Date：	November 17, 2020
Last Order Date：	December 31, 2020