●Change Description
To ensure the continuous improvement and to reinforce the NanEye2D supply chain, ams AG has qualified Xintec for the TSV (Through Silicon Via) process. It is ams intention to use Xintec as the primary source of the TSV process.
●With the introduction of Xintec for the TSV process, a change in the product form is foreseen in the solder bumps which have a rounded shape and will increase the chip stack height. This change also implies an update on the product data-sheet which will reflect the new qualified condition MSL3.
●This is a revision of the PCN05-2018 that was sent on February 26th, 2018. The update includes the following:
■The statement on the changes of material in the product.
■Update of the part number list (2x2 chip versions)

Brand of Product：	ams AG
Part#：	301190004 、 301190011 、 301190021 、 301200033 、 NE2D_RGB_F2.8_FOV120_SGA FT SE 、 NE2D_RGB_F2.7_FOV90_SGA FT SE 、 NE2D_CHIP_RGB_SGA CON FT SE 、 NE2D_CHIP_B&W_SGA CON FT SE More Part#
Product Category：	More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	February 10, 2020
Version Number：	2x2 version
Data Encoding：	PCN07-2020
Data Size：	413 KB