Assembly & sorting factory addition for LFQFP package products (MCO-AC-23-0016)
Post time:2024-06-05 17:02:24
Poster:Innovo Technology
From:Network
●Description of Change:
■Group name: R7F0C003M2DFB, R7F0C004M2DFB
■Target package: 12mm×12mm 0.5mm pitch 80pin LFQFP
■Additional back-end factory: Renesas Semiconductor KL Sdn. Bhd. (RSKL)
■Assembly material
◆Used materials which certified by additional factory.
■Package outline
◆There is no change in footprint for additional factory products.
■Marking
◆The number of characters in the lot number and the marking font are changed.
■Storage conditions after opening the moisture proof packaging.
◆RSKL products have the same conditions as RSB products.
◆“30℃/70%RH/ within 168hr”
| Renesas | |
| R7F0C003M2DFB-C#BA0 、 R7F0C004M2DFB-C#BA0 More Part# | |
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More | |
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More | |
| PCN/EOL More | |
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More | |
Please see the document for details | |
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More | |
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More | |
| LFQFP | |
| English Chinese Chinese and English Japanese | |
| 5/19/2023 | |
| Initial release | |
| MCO-AC-23-0016 | |
| 229 KB | |
| 10/1/2023 | |
| Assembly & sorting factory addition |