PC8640 migration to lead-free bumps Product Change Notification (GC170751)
Post time:2024-06-05 15:54:21
Poster:Innovo Technology
From:Network
●Product Identification: all PC(X)8640_ _GH_ _ references,
●Reason for Change: Material
●Change Description:
■NXP has announced the replacement of the leaded C4 bumps by Lead free C4 bumps on the 8640 product family. Only bumps (die-to-package) change, solder balls (package-to-board) remain unchanged.
TELEDYNE E2V | |
PC8640 、 PCX8640 、 PC8640DFGH1000HE 、 PC8640DFGH1000HEM3 、 PC8640DFGH1067NC 、 PC8640DFGH1067NE 、 PC8640DMGH1250HE 、 PC8640DVGH1067KE 、 PC8640DVGH1067NE 、 PC8640DVGH1250HE 、 PC8640FGH1067NE 、 PC8640FGH1067NEG5 、 PC8640MGH1250HE 、 PC8640MGH1250HEZB6 、 PC8640VGH1250HC 、 PC8640VGH1250HE 、 PCX8640FGH1067NCG 、 PC8640_ _GH_ _ 、 PCX8640_ _GH_ _ More Part# | |
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PCN/EOL More | |
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Please see the document for details | |
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English Chinese Chinese and English Japanese | |
February 16th, 2017 | |
Rev L | |
GC170751 | |
200 KB |