Discrete Wafer FAB Material PRODUCT CHANGE NOTICE (2559)
Post time:2024-06-05 15:52:30
Poster:Innovo Technology
From:Network
●DESCRIPTION OF CHANGE
■This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes internal wafer fabrication source (SSEC FAB) has qualified 4 inch diameter wafers with an additional semi-insulating polysilicon (SIPOS) layer replacing 3 inch diameter wafers on select products listed below.
■Full electrical characterization and high reliability testing has been completed on representative part numbers to ensure no change to device functionality or electrical specifications in the datasheet. Refer to the attached qualification report embedded in this file (to view, download this PCN file then open it with a PDF viewer to see the attached qual report).
■There will be no change to the Form, Fit, or Function of affected products.
DIODES | |
DFLR1600-7 、 DFLR1400-7 、 DFLR1200-7 、 DFLR1600Q-7 More Part# | |
Wafer More | |
More | |
PCN/EOL More | |
More | |
Please see the document for details | |
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More | |
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English Chinese Chinese and English Japanese | |
1 December, 2021 | |
REV 1 | |
2559 | |
138 KB |