Extent of Change:The composition of the bond wire is changing from Gold (Au) to Copper/Palladium/Gold (CuPdAu).
Reason for Change:This change will insure an uninterrupted flow of product and provide increased flexibility for supply chain management.

Brand of Product：	Central Semiconductor
Part#：	CWDM3011N 、 CWDM3011P 、 CWDM305N 、 CWDM305ND 、 CWDM305P 、 CWDM305PD More Part#
Product Category：	More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	SOIC-8
Language：	English Chinese Chinese and English Japanese
Date of Creation：
Version Number：
Data Encoding：	PCN #203
Data Size：	262 KB