●Subject: Add KESP, Malaysia as Alternate Test Location and REPG, Malaysia as Alternate Backend Location
●Effective Date: 10/25/2023
●Revision Description: Initial Release
●Description of Change:
■Renesas is adding KESP, Malaysia as an alternate Test location and REPG, Malaysia as an alternate Backend location for the select part#. MEMS Vision, Canada is the current Test and Backend location.
■This change will allow flexibility to ship from either facility and will provide the increased capacity, flexibility and shorter lead time to meet market demand. Renesas has completed the electrical test correlation and based on the test results we do not anticipate any impact on device performance. The testing is fully compatible and transferrable between the test facilities with no change to the test coverage.
●Affected Product List: Refer Appendix B.
●Reason for Change: To provide increased capacity.
●Impact on Fit, Form, Function, Quality & Reliability:
■The change will have no impact on the form, fit, function, quality, reliability and environmental compliance of the products.
●Product Identification:
■Traceability to the Test and Backend location is available on request.
●Qualification Status: Sensor accuracy and electrical characterization completed successfully. Refer Appendix A
●Sample Availability Date: 8/8/2023
●Device Material Declaration: Not applicable

Brand of Product：	Renesas
Part#：	HS3001 、 HS3102 、 HS4011 、 HS4111 、 HS3002 、 HS3103 、 HS4013 、 HS4113 、 HS3003 、 HS4001 、 HS4101 、 HS3101 、 HS4003 、 HS4103 More Part#
Product Category：	More
Application：	More
Data Type：	PCN/EOL More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	7/26/2023
Version Number：
Data Encoding：	PCN230013
Data Size：	469 KB
Effective Date：	10/25/2023
Type of Change：	Add Test Location